Nanotechnology Educational Resources

Forsight
http://www.foresight.org
Foresight Institute’s goal is to guide emerging technologies to improve the human condition. Foresight focuses its efforts upon nanotechnology, the coming ability to build materials and products with atomic precision, and upon systems that will enhance knowledge exchange and critical discussion, thus improving public and private policy decisions.

CRN

http://www.crnano.org/

Center for Respnsible Nanotechnology

The Institute of Nanotechnology

http://www.nano.org.uk/

The Institute of Nanotechnology has been created to foster, develop and promote all aspects of science and technology in those domains where dimensions and tolerances in the range of 0.1 nm to 100nm play a critical role

UCSC Engineering

http://www.cse.ucsc.edu/research/vision.html

University of California, Santa Cruz / Baskin School of Engineering

Department of Mechanical Engineering University of Berkley
Nanotechnology Initiative Research Group

http://www.me.berkeley.edu/nti/home.html

NSL NanoStructures Laboatory
http://nanoweb.mit.edu/
The Nanostructures Laboratory (NSL) at MIT develops techniques for fabricating surface structures with feature sizes in the range from nanometers to micrometers, and uses these structures in a variety of research projects. The NSL is closely coupled to the Space Nanotechnology Laboratory (SNL) with which it shares facilities and a variety of joint programs.

MIT Stanford UC Berkly Nanotechnology Forum
The MIT•Stanford•UC Berkeley Nanotechnology Forum is an all-volunteer organization. It is organized under the MIT Club of Northern California and has affiliations with MIT, Stanford University, and the University of California at Berkeley. The Forum is run by the Chairman and is guided by the Steering Committee.

Reverse Engineering, Engineering Design, Reverse Engineering Process

3D Scanner, 3D Scanning, and 3D Scanners along with technology for 3D Scanners

Reverse Engineering can be defined as the process wherein a device’s, object’s, or system’s technological principles are discovered by analyzing its operation, function, and structure. It often refers to detaching something, say- a software program, electronic equipment, or mechanical device and carrying out the analysis of its workability in detail. This is done in order to manufacture a new program or device which performs the same function without doubling anything from original.

Motivation: Reasons behind the emergence of reverse engineering include interoperability, lost documentation which means loss or non-existence of documentation of the concerned device, product analysis, security auditing, exclusion of protection of copy, circumvention of restrictions regarding access, and fraud.

‘Reverse Engineering’ of ‘mechanical devices’ : With the ever-increasing popularity of CAD, ‘reverse engineering’ has proven to be a blessing for creation of ‘3D virtual model’ of the on hand physical part to be used in 3D CAE, CAM, CAD and many other soft wares. The measuring of physical object can be done by making use of ‘#D scanning technologies’ such as computed tomography, ‘structured light digitizers’, laser scanners, and CMMs. The data that is measured usually gets represented as ‘point cloud’. It is devoid of topological information. That’s why, the processing and modelling takes place into usable format like a ‘triangular faced mesh’, CAD model, or a collection of surfaces of NURBS. Applications such as Polyworks, Image ware, Geomagic, or Rapidform are used for processing the ‘point clouds’ into the formats that can be used in applications like 3D CAE, CAM, CAD or visualization.

‘Reverse Engineering’ of ‘software’ : The term ‘reverse engineering’ differs from person to person when applied in terms of software. As per the research conducted by Cross and Chikofsy, reverse engineering can be referred to as the process that involves the analysis of the subject system for creating its representation at the higher level. This level might be called the ‘level of abstraction’. As far as software is concerned, reverse engineering can be described as an examination process only. There is no modification from the software point of view. The use of ‘software anti-tamper technology’ takes place in order to deter reengineering and reverse engineering of the software-powered systems and proprietary software.

Two major reverse engineering types exist in the present scenario. In the first type, source code is available, but program’s greater level aspects are poorly documented or invalidated. In the second type, source code does not exist. Any efforts made in this direction would be termed as ‘reverse engineering’. The 2nd use is that which majority of people know. ‘Reverse Engineering of software’ is implied at making use of ‘clean room design’ technique for avoiding infringing copyrights. In today’s world, around 95% of reverse engineering consists of ‘reverse engineering of software’.

On the other hand, ‘black box testing’ in ‘software engineering’ has many similarities to reverse engineering. The tester normally possesses the API. However, their main goal is to locate undocumented features and bugs by smashing the products from the outside. This process is used for customizing the embedded systems as well.
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Enviromental Gauges

San Clemente, CA – Reynard Corporation, a leading global supplier of optical components and custom thin film coatings announces thin film-based environmental gauges.

Thin film-based environmental gauges are manufactured by depositing environmentally susceptible coating materials onto an inert substrate.  Coating materials are typically deposited in a custom defined quasi-grid pattern of lines.  Redundant traces, matched in length and size, can be implemented to monitor environmental changes over a small region, such as for rising gas or fluid conditions, or to provide damage protection when used in abrasive conditions.  Unmatched lines allow for the variable open-space monitoring of increasing corrosion levels, or for the monitoring of different types of corrosive elements.  Grid configurations are designed for specific operational environments and can utilize a combination of matched and unmatched lines to achieve the required electrical characteristics.

The detection of environmental caused degradation is accomplished by monitoring the change in electrical characteristics from one side, or zone, of the environmental gauge to another.  Photolithography techniques are utilized to achieve repeatable, high-precision transmission characteristics in confined areas to meet your system requirements. “Environmental gauges are a unique way of monitoring corrosive environments” says Forrest Reynard, President of Reynard Corporation.
Materials such as Copper, Silver, Aluminum, Iron, and Zinc are commonly used for these lines, although other materials, or dopants, required for specific applications can also be deposited.  Traces can be added to most any substrate type, even to flexible substrates such as MelinexR.

Reynard Corporation’s thin film engineers will work closely with you to ensure product key characteristics are properly defined and the highest reliability product is delivered on-time to meet the demands of your custom application.

Key Characteristics:
. Custom grid line configurations
. Photolithography based precision and repeatability
. Materials to match your application

About Reynard Corporation
Established in 1984, Reynard Corporation designs and manufactures precision thin film optical products for a global customer base, both military and commercial.  In-house operation capabilities include design, fabrication, photolithography, coating, and sub-assembly for a one-stop solution.  Contact our Sales Department for further information  (949)366-8866 , info@reynardcorp.com or for a free optical reference and product catalog, or visit our webpage for online ordering and reference at http://www.reynardcorp.com