SILTERRA EXPANDS HIGH VOLTAGE TECHNOLOGY

After the recent announcement of 90nm and 65nm technology plans, Silterra Malaysia, the leading foundry in Malaysia today announced the availability of 0.16µm high voltage technology for mass production in Q3 this year and the roadmap to 0.13µm high voltage technology in the first quarter of next year.

Silterra is currently a leading foundry on 0.18mm high voltage process technology. Its innovative high density, high-voltage process technologies are specially designed for display driver applications that require complex logic, large memory blocks and high voltage handling capability on the same chip. The existing 0.18mm high voltage process is currently running in volume production with excellent yield. The company has consistently exceeded stringent requirements such as high density SRAM blocks and low leakage performance for display driver chips from major customers in US, Korea, Japan and Taiwan. As display panel technology is transitioning to higher resolution quality such as WQVGA (Wide-Quarter-VGA) and HVGA (Half-VGA) for more video and 3D applications in handheld consumer devices, Silterra is enabling customers to win this transition with our 0.16mm and 0.13mm high voltage technologies.

“Silterra is laser-focused on creating world-class high-voltage process technology to help our customers win the display driver chip market.” said Kah Yee Eg, Chief Executive Officer of Silterra.

“The explosion of multimedia digital content is driving the demand surge for the high-resolution display for handheld devices. This is the key driver for the high voltage technologies and we are pleased with our leadership position with the existing 0.18mm high-voltage process technology. We recognize that for Silterra to be preferred long-term partner, it is important that we continue to invest and develop new technology to lead the market. We are pleased to announce the availability of 0.16mm high voltage process technology in Q3 this year for mass production. We are also pleased to announce that our 0.13mm Aluminium-based high voltage process technology development is on track and is targeted for pilot run in Q1 next year.”

Eg added, “We are progressing very well on our 0.16µm and 0.13µm manufacturing metrics and production roadmap. We are committed to offer world-class process quality, device yield and cycle times to our customers. In addition, we will expand our capacity for high voltage by 30% in Q4 to meet surging demand.”

About Silterra Malaysia Sdn Bhd:

Market demand driven, Silterra Malaysia Sdn Bhd is a semiconductor wafer foundry offering major foundry compatible CMOS logic, high-voltage and mixed-signal/RF technologies down to 0.13-micron feature size. This includes complete, competitive contract manufacturing for fabless and IDM customers’ designs. Silterra’s wafer fab has a design capacity of 40,000 eight-inch wafers per month. 

 

Environmentally vigilant, Silterra delivers award winning, world-class performance to its customers seeking flexible capacity, competitive advantages and around the clock customer support. Silterra is ISO 9001:2000 and ISO 14001 certified. Founded in 1995, the company’s headquarters and factory are located in Malaysia’s Kulim High-Tech Park, and Silterra has sales and marketing offices in San Jose (California) and Hsinchu (Taiwan). 

 

For additional information on Silterra or its services, please visit www.silterra.com.

JCET (Jiangsu Changjiang Electronics Technology Co., Ltd.) makes Joint Venture with Best (Best Electronics & Components Co.) for turnkey services to providing closer, broader and timely support to the U.S. and World semiconductor market.

SAN JOSE, CA, – Jiangsu Changjiang Electronics Technology (JCET) and Best Electronics & Components Co. (Best) are pleased to announce that the two companies have signed a joint venture partnership agreement to provide packaging turnkey services to US customers.

    JCET, based in Jiangyin City, Jiangsu Province, China, is currently one of China’s largest semiconductor assembly and test companies which translates to over 3 Billion units per month. Along with its subsidiary, Jiangsu Changjiang Advanced Packaging Co.(JCAP), JCET provides a wide range of packaging services from wafer bumping, WL-CSP, leadframe and laminate packaging and testing. Its current customer base includes several prominent US IDMs and design houses. JCET wanted to support US customers better by providing  local US technical and customer support. After researching several companies JCET choose to work with Best.

Best was chosen because of their expertise and established presence in Silicon Valley.
The joint venture will enable JCET to provide closer, broader and timely support to the U.S. semiconductor market as well as the World Market.  Best, has had 25 years of experience marketing semiconductor assembly and test services focusing on the semiconductor test development – instruments, software and hardware. Specifically in wafer sort, final test and tape and reel services; specialize in testing of analog and mixed signal semiconductors including: Mosfets, power discrete, precision temperature sensors, voltage reference, A/D converters, OpAmps & linear devices.
 
    “JCET is looking forward to a successful joint venture with Best and closer ties between the two companies in the future,” says Dr. Bill Li, General Manager of JCET North America Operations.
About JCET
Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) is the leading semiconductor packaging company in China. It provides a wide range of packaging assembly and test services for various integrated circuits and discrete devices. JCET is a public company listed on Shanghai Stock Exchang. In 2007, JCET ranked among the top 100 electronics companies in China and was named among the Top 10 Most Innovative Hi-Tech Companies in China.

About Best
Established in 1992, Best Electronics & Components Co. offers total parametric and functional test solutions for analog and mixed signal integrated circuits. USEA is specifically configured for low cost, high volume, wafer sorting and final electrical testing of chip scale and packaged circuits. This allows customers to have additional capital available for design of new products or reserve capital for other needs. Best provides a complete spectrum of engineering and manufacturing services to support these products, i.e., test program development & conversion, wafer back-lapping and electrical sorting, sawing, assembly, final electrical test, data collection & analysis, tape & reel, and drop shipments to end customers.

For more information please visit www.usea.com

SilTerra Receives Technology Implementation Award From Frost & Sullivan

SilTerra Malaysia Sdn. Bhd., a leading wafer foundry provider, officially received the 2009 South East Asia Technology Implementation Award from Frost & Sullivan, an independent industrial research and consulting firm. The award is a timely recognition and endorsement of SilTerra’s leadership and accomplishment in our engineering and manufacturing capabilities for High Voltage Technology. The Award Steering Committee of Frost and Sullivan chose SilTerra because of its significant contributions in building advanced CMOS technology capability in Malaysia and in raising Malaysia’s international profile in the global semiconductor industry.
 
SilTerra is one of the market leaders in High Voltage Technology for the small and medium TFT display driver integrated circuit (IC) market. Currently, it is shipping more than 150 millions IC’s a year to world-class fabless IC design houses worldwide. The display driver is a critical component in the display panel of mobile electronic devices such as Mobile phone, MP3, Digital Camera, Portable Media Player and etc. The function of each display driver is to process the video image signals and convert to rich colors (eg. 262K or 16M colors) and high pixel resolutions used in the TFT panel such as QVGA (Quarter Video Graphic Array), HVGA (Half VGA) or WVGA (Wide VGA).   
 
“We would like to thank Frost & Sullivan for this award. For the Silterra team, this is a huge honour and a solid recognition of both our engineering capabilities to build innovative technology and our manufacturing capabilities to mass produce advanced technology in hundreds of millions of parts with consistently high yield and quality.  We are committed to this market and will continue to accelerate our leadership in this technology with more innovative breakthroughs and more design wins with world-class customers especially in the high-definition and energy-efficient driver IC market,” said Dr. Kamarulzaman Zin, the Executive Committee Chairman of Silterra Malaysia.
 
“At SilTerra, we have been growing our High Voltage wafer foundry business since 2002, starting from 220nm technology node until today’s 130nm technology. We will be rolling out 0.11u and 90nm technology soon,” he added.
About SilTerra Malaysia Sdn Bhd:
Market driven, SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering major foundry compatible CMOS logic, high-voltage and mixed-signal/RF technologies down to 90nm  feature size. The broad choice of mature technologies and IP’s, flexibility and capabilities enable Silterra to serve broad range of customers from fabless to IDM in highly dynamic consumer electronics and communication applications. SilTerra’s wafer fab has a designed capacity of 40,000 eight-inch wafers per month. 

Environmentally vigilant, SilTerra delivers award winning, world-class performance to its customers seeking flexible capacity, competitive advantages and around the clock customer support. SilTerra is ISO 9001:2000 and ISO 14001 certified. Founded in 1995, the company’s headquarters and factory are located in Malaysia’s Kulim High-Tech Park, and SilTerra has sales and marketing offices in San Jose (California) and Hsinchu (Taiwan). 

For additional information on SilTerra or its services, please visit www.silterra.com.